THE CHIP INDUSTRY IS MOVING.
ATLAS-I IS COMING.
The traditional boundaries of silicon are officially history. SOKB Semiconductor unveils a fundamental leap in hardware engineering: the ATLAS-I Chiplet Architecture. Built from the ground up to handle intense edge computing workloads, ATLAS-I delivers raw processing power without any thermal penalty.
Break through performance barriers with our chiplet design. Engineered to rewrite the limitations of modern silicon, the ATLAS-I architecture balances raw processing throughput with hyper-optimized physical power networks.
Engineered for Intense Edge Computing Workloads
30% More Efficient
Custom on-die power delivery layers curb extreme thermal leaks, maximizing operational clock limits without driving up power consumption. By segmenting core execution clusters away from high-noise I/O, ATLAS-I operates at top clock ceilings with zero thermal throttling.
50% More Compute Density
Packed physical matrix scaling layout designed intentionally to process extensive neural network calculations smoothly. Dedicated hardware matrix-multiplication lanes provide deterministic throughput for real-time computer vision, sensor fusion, and on-device ML.
The RISC-V Edge Standard
Engineered to handle dense concurrent processing requests under high systemic strain with strict uptime guarantees. 100% sovereign open instruction architecture, free of geopolitical licensing chokeholds and proprietary firmware black-boxes.
ATLAS-I Preliminary Hardware Matrix
Target performance parameters engineered for integration by drone avionics contractors, smart metering infrastructure suppliers, and edge AI hardware builders.
| Architectural Vector | ATLAS-I Specification | Target Advantage |
|---|---|---|
| Compute Topography | Dual-Core / Quad-Cluster Chiplet Tile | Modular die-to-die scalability without full mask re-spins |
| Instruction Architecture | RV32IMAC + Custom Matrix Acceleration | Deterministic real-time control loops and edge neural operations |
| Power Efficiency Metric | +30% Systemic Power Reduction | Extends edge battery life and enables fanless passive enclosures |
| Silicon Compute Density | +50% Logic Density per mm² | Processes dense concurrency without memory bottleneck stalls |
| Fabric Interconnect | 64-bit Low-Latency AXI4 Crossbar | 12.8 Gbps per lane non-blocking crossbar routing |
| Fabrication Node | 40nm Bulk CMOS + Advanced Die Packaging | High yield, low wafer cost, and full India DLI grant eligibility |
Join the ATLAS-I Insider Dispatch Queue
Receive confidential architectural briefing notes, pre-silicon Verilator performance dumps, and early foundry allocation queues directly from the design directorate.