Indigenization & Tape-Out Roadmap
Milestone execution synchronized with the India Semiconductor Mission (ISM 2.0) Design Linked Incentive (DLI) framework, 40nm multi-project wafer (MPW) foundry shuttles, and commercial ATMP packaging.
Phase 1 to Phase 3 Execution Timeline (Months 1–24)
FPGA Digital Twin, Emulation & EDA Bring-Up
Synthesis, verification, and bring-up of the Dual-Core ATLNode processor matrix and 64-bit AXI4 crossbar on Xilinx Kintex-7/Zynq UltraScale+ FPGA platforms. Provisioning of enterprise EDA cloud instances via the MeitY ChipIN Centre. Full hardware emulation of asynchronous SPI bridges and peripheral digital twins.
40nm Physical Design Closure & Pre-Silicon Sign-Off
Execution of full place-and-route (P&R), automated clock tree synthesis (CTS), power grid analysis, and multi-corner sign-off Static Timing Analysis (STA) across all operating corners (SS/FF/TT) utilizing target 40nm standard cell libraries and PDKs. Milestone execution synchronized under the MeitY Chips-DLI framework for pre-silicon closure.
Silicon Tape-Out, MPW Shuttle & ATMP Packaging
Final GDSII database freeze and submission to tier-1 global pure-play foundry Multi-Project Wafer (MPW) shuttles on the 40nm CMOS node. Wafer dicing, post-silicon assembly, packaging into standard 64-pin QFN/BGA packages, and automated test equipment (ATE) characterization at accredited Indian ATMP facilities.
Partner & Institutional Compliance Verification Pack
Access to technical documentation, FPGA testbench reports, SystemVerilog simulation coverage logs, and ISM 2.0 governance packs for enterprise partners.