ISM 2.0 / DLI ALIGNED
NATIONAL INCENTIVE ALIGNMENT • MeitY

ISM DLI Compliance & The Tape-Out Roadmap

Execution synchronization with the India Semiconductor Mission (ISM 2.0) Design Linked Incentive (DLI) framework, multi-project wafer (MPW) scheduling, and statutory DPIIT deep-tech governance.

Milestone Execution Vectors

Phase 1 to Phase 3 Execution Timeline (Months 1–24)

PHASE 01 • MONTHS 1–6

FPGA Emulation, ChipIN EDA Setup & COTS Hardware Twin

ACTIVE EXECUTION

Synthesis and bring-up of the Dual-Core Hazard3 (RV32IMAC) processor matrix and 64-bit AXI4 crossbar on Xilinx Kintex-7/Zynq UltraScale+ FPGA platforms. Provisioning of enterprise EDA cloud instances via the MeitY-funded ChipIN Centre (Synopsys Design Compiler, PrimeTime, Cadence Innovus). Physical verification of asynchronous SPI host bridges connected to commercial off-the-shelf (COTS) Wi-Fi and Bluetooth companion radios, ensuring compatibility with SCL Mohali test structure baselines.

DELIVERABLE:
FPGA Bitstream Validated
TOOLCHAIN:
ChipIN Cloud Grid
RADIO VERIFICATION:
COTS Modules Hosted
PHASE 02 • MONTHS 7–12

DLI Detailed Project Report (DPR) Clearance & Physical Design Sign-off

PORTAL SUBMISSION QUEUED

Formal Detailed Project Report (DPR) clearance through the dedicated Chips-DLI Portal under MeitY guidelines. Mobilization of the 50% design subsidy reimbursement tranche. Execution of full place-and-route (P&R), automated clock tree synthesis (CTS), power grid analysis, and sign-off Static Timing Analysis (STA) across all operating corners (SS/FF/TT) utilizing target 40nm standard cell libraries and PDKs.

PORTAL TARGET:
Chips-DLI MeitY Clear
PHYSICAL CLOSURE:
PrimeTime Sign-off
GOVT SUBSIDY:
50% Match Enabled
PHASE 03 • MONTHS 13–24

GDSII Tape-Out, Multi-Project Wafer (MPW) Shuttle & ATMP Packaging

FOUNDRY SCHEDULED

Final GDSII database lock and submission to tier-1 global pure-play foundry Multi-Project Wafer (MPW) shuttle (TSMC / GlobalFoundries / UMC 40nm node). Wafer dicing and post-silicon assembly, packaging into standard 64-pin QFN/BGA packages, and automated test equipment (ATE) functional characterization at accredited Indian packaging and testing (ATMP) facilities.

TAPE-OUT FORMAT:
GDSII Hard Database Lock
FOUNDRY RUN:
Global 40nm MPW Slot
PACKAGING:
QFN64 / BGA ATMP
Statutory Regulatory Check

Sovereign Compliance Status Monitor

Rigorous tracking of SOKB Semiconductor's alignment with DPIIT deep-tech startup directives, domestic ownership mandates, and open-source intellectual property hygiene.

CRITERION 01 VERIFIED COMPLIANT

DPIIT Deep-Tech Startup Criteria

Formally structured under Startup India DPIIT recognition guidelines for semiconductor design and hardware IP creation. Meets the mandated R&D expenditure threshold (>15% of annual operational expenditure allocated strictly to core electronic VLSI engineering).

Status: Entity Registered in Barabanki, UP
CRITERION 02 VERIFIED COMPLIANT

Domestic Equity Ownership Control

Complies strictly with the statutory DLI prerequisite of retaining greater than 50% equity shareholding by Indian resident citizens and promoters. Board voting control and management control remain exclusively domestic without foreign controlling covenants.

Status: 100% Resident Indian Shareholding
CRITERION 03 VERIFIED COMPLIANT

Open-Source Licensing Governance

Full legal audit completed for open RISC-V components (Hazard3 core licensed under permissive Apache 2.0). All proprietary peripheral macros and AXI4 crossbar IP maintain clear separation boundaries, protecting downstream commercial licensees from AGPL viral copyleft claims.

Status: Clean Apache-2.0 / Commercial Segregation
GOVERNMENT COMMITTEE & FOUNDRY AUDIT READY

Complete documentation packs (Articles of Association, DPIIT Registration Certificate, Cap Table, and SystemVerilog Verification Reports) are available to ISM PMAC evaluators upon request.

Request Audit Dossier